NAS XC - NAS®

Products

NAS® XC

NAS® XC is a styrene methyl methacrylate copolymer that can be used in a variety of applications demanding a low haze and extreme clarity.

Key Features

High surface quality
Transparency
Low density
Water clear appearance

Applications

Automotive rear light housings

Industries

Technical Data Sheet ISO PDF | EN

Grade Version
NAS XC I26
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Safety Data Sheet
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REACH and other Regulatory Documents
Absence Declaration Of Ozone-Depleting S
PDF | 0.15 MB | EN

Absence Declaration Rohs & Weee Directiv
PDF | 0.15 MB | EN

Reach Compliance Declaration
PDF | 0.15 MB | EN

Regulatory Information Sheet
PDF | 0.15 MB | EN

Svhc Declaration
PDF | 0.15 MB | EN
NAS XC PM H300
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Safety Data Sheet
Download Safety Data Sheet

REACH and other Regulatory Documents
Absence Declaration Of Ozone-Depleting S
PDF | 0.15 MB | EN

Absence Declaration Rohs & Weee Directiv
PDF | 0.15 MB | EN

Reach Compliance Declaration
PDF | 0.15 MB | EN

Regulatory Information Sheet
PDF | 0.15 MB | EN

Svhc Declaration
PDF | 0.15 MB | EN
Non-public Documents

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Properties

Properties of NAS XC

Property, Test Condition	Standard	Unit	Values
Rheological Properties
Melt Volume Rate 220 °C/10 kg	ISO 1133	cm³/10 min	24
Mechanical Properties
Charpy Notched Impact Strength, 23° C	ISO 179/1eA	kJ/m²	1.4
Charpy Unnotched, 23 °C	ISO 179/1eU	kJ/m²	20.5
Izod Notched Impact Strength, 23 °C	ISO 180/A	kJ/m²	1.7
Tensile Modulus	ISO 527	MPa	3400
Tensile Stress at Yield, 23 °C	ISO 527	MPa	65
Tensile Strain at Break, 23 °C	ISO 527	%	3
Flexural Modulus, 23 °C	ISO 178	MPa	3200
Flexural Strength, 23 °C	ISO 178	MPa	101
Hardness, Ball Indentation	ISO 2039-1	MPa	163
Thermal Properties
Vicat Softening Temperature VST/B/50 (50N, 50 °C/h)	ISO 306	°C	98
Heat Deflection Temperature A; (annealed 4 h/80 °C; 1.8 MPa)	ISO 75	°C	99
Optical Properties
Refractive Index, Sodium D Line	ISO 489	-	1.54
Haze	ASTM D 1003	%	0.3
Light Transmission at 550 nm	ASTM D 1003	%	93
Other Properties
Density	ISO 1183	kg/m³	1110
Water Absorption, Saturated at 23 °C	ISO 62	%	0.17
Processing
Melt Temperature Range	ISO 294	°C	200 - 240
Mold Temperature Range	ISO 294	°C	32 - 60
Drying Temperature	-	°C	82
Drying Time	-	h	2

Typical values for uncolored products
Please note that all processing data stated are only indicative and may vary depending on the individual processing complexities.
Please consult our local sales or technical representatives for details.

Processing

Processing of NAS XC

Processing

NAS

ZYLAR

Grade

Item Properties Units

30 / 36

631

530 /53X

330 / 390

220 / 221

^oF/hrs

1. Material Drying*

^oC/hrs

180/2

82/2

180/2

82/2

180/2

82/2

150/2

65/2

150/2

65/2

150/2

65/2

150/2

65/2

Process Temp

^oF

Melt

^oC

420

216

420

216

420

216

430

210

430

210

430

210

430

210

^oF

Nozzle

^oC

440

227

440

227

450

243

440

227

440

227

440

227

440

227

^oF

Front

^oC

420

216

420

216

420

216

385

196

385

196

385

196

385

196

^oF

Middle

^oC

400

204

400

201

400

204

375

191

375

191

375

191

375

191

^oF

Rear

^oC

370

188

370

188

370

188

365

185

365

185

365

185

365

185

^oF

Mold Temperature

^oC

130

100

4. Injection Speed

Slow to

Moderate

Slow to

Moderate

Slow to

Moderate

Moderate to Fast

5. Back Pressure PSI (min.)

Moderate

100

6. Screw Speed RPM (min.)

Inches

7. Cushion

0.125

8. Cycle Time

Wall Thickness

Inches mm

0.020 0.50

0.040 1.00

0.060 1.50

0.080 2.00

0.100 2.53

0.120 3.00

0.160 4.05

0.200 5.06

Cycle Time

Seconds

10-13

15-19

20-26

25-33

30-39

35-45

45-58

55-69

Purging Guidelines:

For best ZYLAR trial results, a thorough purging of the molding machine prior to running ZYLAR is critical as any contamination left in the barrel, hot runner system, or mold can result in hazy parts.

The preferred purge material is NAS. The best NAS purge material for running ZYLAR 220 or 221 is NAS 21. For all other ZYLAR grades, NAS 30 is recommended for purging. If NAS is not available for purging, crystal polystyrene is an acceptable alternative and better than leaving another higher temperature material in the machine.

If the material that was being used in the molding machine prior to the ZYLAR was run at a higher barrel temperature profile (ex. Polycarbonate @ 550°F or PMMA @ 480°F), then it is best to re-heat the machine initially to those same temperatures. Then, flush the appropriate NAS material through the unit until it runs clear before dropping the temperatures to the recommended ZYLAR conditions. After cooling, flush with a few pounds of ZYLAR.

If the material being used prior to the ZYLAR was run at a lower temperature, then heat the machine up to the desired settings for running ZYLAR and follow the above procedures for purging first with NAS, and then ZYLAR.

Flushing the machine until you see a clear ZYLAR purge patty is not critical. In fact at high temperatures ZYLAR can be very hazy, and the patty will hold a hot temperature for an extended period of time. Ejected molded parts may exhibit this same haziness until cooled.

For NAS trials you can follow the procedures above, excluding the use of any ZYLAR materials.

Finally, if present, any tiny streaks of white, colors, or haze can be an indication of contamination in the machine. If this occurs then continue to purge the system.

Drying:

Drying is not always necessary. If the molded parts are very large or the Plant is located in a very humid region, then you may need to dry the material according to the instructions on the front of this technical bulletin. This is only needed for surface drying of the material, as it will not absorb large amounts of water. The effects of not drying under the above conditions are strictly esthetic, and will not affect the physical properties of the final parts.

Safety Data Sheet

Choose grade version

Download Safety Data Sheet

Products

NAS® XC

Key Features

Applications

Industries

NAS XC I26

Safety Data Sheet

REACH and other Regulatory Documents

NAS XC PM H300

Safety Data Sheet

REACH and other Regulatory Documents

Non-public Documents

Properties of NAS XC

Processing of NAS XC

Processing

Purging Guidelines:

Drying: